Home > HDI PCB Board >

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

Product Categories

FR4 Multilayer PCB [36]
HDI PCB Board [25]
Double Sided PCB [3]
High TG PCB [19]
High Frequency PCB [13]
Aluminum Clad PCB [5]
FPC Board [19]
Rigid Flex PCB [24]
PCB Accessories [5]

Shenzhen Fany Technology Co.,Ltd

Contact Now

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

Brand Name : OEM

Model Number : Customized

Certification : ISO9001/ISO14001

Place of Origin : Guangdong China

MOQ : 5pcs

Price : negotiable

Payment Terms : T/T

Supply Ability : 10000pcs per month

Delivery Time : 10-14 wds

Packaging Details : 25 sets in Vacuum bag/ Carton

Material : High TG FR4

Layers : 2-48 layers

Max size : 610X915mm

Min Via : 0.1mm

Surface treatment : ENIG

Color : Matt Green

Board thickness : 0.15-4.5mm

Outer layer copper thickness : 1/3-12OZ

Contact Now

High TG170 FR4 Multilayer HDI PCB with Buried and Blind Via Holes

1. Product Descprition

Item	Specification
Material	High TG FR4
Layers	4-20 layers
HDI	HDI plus 1 or 2
Copper thickness	1/3-12OZ
Minimum Via	0.1mm
Surface treatment	ENIG,OSP
Board thickness	0.15-4.5mm
Solder mask color	Gree,Blue,Black,Red,White
Tolerance of board thickness	T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm

2.HDI capablity and example

1) X+X process

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

2) 1-N-1 process

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

3)2-N-2 process-B

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

4)2-N-2 process-N(Advanced:6+N+6)

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes

( Layer Drawing) (Cross section)

3. Application

1)Communication electronic equipment:Smartphone,Multifunctional Phone,visual telephone

2)Computer:Laptop, Super computer, Pad.

3) Consumer Electronics: Camera, Digital TV, Video

4) Car

5) Equipments

6) Space and aviation: satellite,guided missile

7) Medical Appliances

8) Industral Control

4.Package

Product Tags:

hdi pcb design

pcb hdi

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes Manufactures

High TG170 FR4 Multilayer HDI PCB Board Buried and Blind Via Holes Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Fany Technology Co.,Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!